HID Global partners with Infineon Technologies (IFX) to enhance card flexibility for e-ID/Smart Card manufacturers

Partnership with Infineon Technologies AG to incorporate secure microcontroller chips in new HID Global ultra-thin Polycarbonate (PC) ePrelaminate inlay solution.

HID Global, an expert in trusted identity solutions, today announced Infineon Technologies AG as a new partner supplying the chips for their ultra-thin Polycarbonate (PC) ePrelaminate inlay for electronic ID (e-ID) cards. The inlays are more than 30 percent thinner than alternatives freeing space for added security features. The offering uses patented HID DBond technology which is available for high frequency (HF) systems.

Infineon is HID Global’s second qualified partner supplying IC chips for this product. HID Global’s new inlay takes advantage of its proven process of directly bonding chips to wire-embedded air-coil antennae for low-frequency animal ID and automotive applications, without the bulk of added modules. The company has successfully leveraged its HID DBond technology for HF applications, enabling manufacturers to develop the smallest HF formats available in the market while delivering uncompromised performance. By using this method in its new ultra-thin inlays, HID Global is providing the technology to deliver smart cards with a durable and reliable connection between the card’s intelligence – the microcontroller chip – and its antennae.

In addition, the thinner inlay offers e-ID and smart card manufacturers more flexibility in card construction. The reduced dimensions of HID Global’s ultra-thin inlays – 200 microns instead of the typical 350 microns – provide manufacturers with room to add more security features on both sides of an e-ID card during construction, while still complying with international ISO thickness standards.

Infineon Technologies successfully qualified its SLE78CLX1600 security controller chip for inclusion in HID Global’s new ultra-thin PC e-Prelaminate inlay. The introduction of the Infineon chip in the ultra-thin ePrelaminate portfolio is the result of a close partnership between the two companies.

A special Megabump design (perfectly fitting with the SLE78CLX1600 chip) has been developed in order to allow the Infineon chip to be compatible with HID DBond technology, offering customers a secure and reliable solution that can be applied to many ID card applications. See also www.hidglobal.fr/   www.infineon.com/

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